We also have a robust in house layout capability and do the vast majority of board designs in-house. 

We use Atium DXP for both layout and schematic capture greatly simplifying and reducing errors when schematics are committed to actual copper.

Here are some highlights of layout capabilities:

• Fine pitch BGA designs (0.5mm)
• High speed differential (LVDS, HSTL, USB, etc.)
• Controlled impedance and dielectric for fast edge rate designs
• Up to 12 layer boards
• Extensive experience with layout for EMC and EMI
• Blind and buried via experience for high density space constrained designs
• Power/ground plane segmenting and islands for ultra sensitive analog circuitry
• Detailed Design For Manufacturing (DFM) checks to get boards right the first time